Indian Welding Journal

A. Murugan ¹, T. Senthilvelan ¹, V. Balasubramanian ²

Affiliations
1 Department of Mechanical Engineering, Pondicherry Engineering College, Puducherry 607 402, IN
2 Centre for Materials Joining and Research (CEMAJOR), Department of Manufacturing Engineering, Annamalai University, Annamalai Nagar, 608 002 Tamil Nadu, IN

Abstract

In the present study, pure aluminium (Al) and pure copper (Cu) plates prepared by powder metallurgy (P/M) method were bonded by diffusion bonding technique. From the literature, it was identified that the predominant diffusion bonding process parameters such as bonding temperature, holding time and bonding pressure influence the shear and bonding strength of diffusion bonded joints. In this investigation an attempt was made to develop empirical relationships to predict the shear strength and bonding strength of diffusion bonded bimetallic joints of pure Cu/AI incorporating the above parameters using statistical tools such as design of experiments, analysis of variance and regression analysis. The developed empirical relationships can be used to predict the strength of Cu/AI bimetallic joints at 95% confidence level.

Keywords

Pure Copper, Pure Aluminium, Powder Metallurgy, Diffusion Bonding, Design of Experiments, Analysis of variance and Regression Analysis.

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A. Murugan ¹, T. Senthilvelan ¹, V. Balasubramanian ²

Affiliations
1 Department of Mechanical Engineering, Pondicherry Engineering College, Puducherry 607 402, IN
2 Centre for Materials Joining and Research (CEMAJOR), Department of Manufacturing Engineering, Annamalai University, Annamalai Nagar 608 002, IN

Abstract

In this investigation, pure aluminium (Al) and pure copper plates manufactured by powder metallurgy (P/M) technique were bonded by diffusion bonding. Joining of these materials by fusion welding is difficult because of the formation oxide films and brittle intermetallic compounds in the bond region which affect the quality of bonds. However, diffusion bonding is a suitable process to join these materials without much difficulties. In this investigation, an attempt was made to develop the diffusion bonding windows to join pure Al with pure Cu plates produced by P/M technique using different combinations of process parameters such as bonding temperature, bonding pressure and holding time The quality of bonds was checked by the microstructure analysis. Diffusion bonding windows (DBW) presented in this paper will act as reference maps for selecting appropriate process parameters to join pure Al with pure Cu plates fabricated by P/M technique.

Keywords

Pure Aluminium, Pure Copper, Powder Metallurgy, Diffusion Bonding Window.

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G. Mahendran ¹, V. Balasubramanian ¹, T. Senthilvelan ², A. K. Lakshminarayanan ¹

Affiliations
1 Centre for Material Joining & Research, Manufacturing Dept., Annamalai University, IN
2 Mech. Engg, Pondicherry Engineering College, Pondicherry, IN

Abstract

The principal difficulty when joining Aluminium (Al) and commercial grade Copper (Cu) lies in the existence of formation of oxide films and brittle intermetallics in the bond region. However, diffusion bonding can be used to join these alloys without much difficulty. Temperature, pressure and holding time are the three main variables, which govern the integrity of the diffusion bonds. The experiments were conducted based on three factors, five-levels, and central composite rotatable design with full replications technique. Empirical relationships were developed to predict diffusion layer thickness, hardness, strength of Al-Cu joints incorporating process parameters using Response Surface Methodology. The developed relationships can be effectively used to predict the bond properties at 95 % confidence level.

Keywords

Diffusion Bonding, Aluminium Alloy, Commercial Grade Copper, Lap Shear Tensile Strength, Ram Tensile Strength.

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